Search results for "Power MOSFET"

showing 10 items of 23 documents

Parasitic Bipolar Action in SiC Power MOSFETs Demonstrated by Two-Photon Laser Experiment

2018

A two-photon absorption technique is explored for Silicon carbide power MOSFETs and power junction barrier Schottky diodes using a pulsed laser. The similarities in design between the specific MOSFETs and diodes tested permit using mechanisms existing in the different structures as explanation for observed current variation with laser position. The diode shows variation in average current with change in laser depth only, whereas the MOSFET shows variation both with shifts in depth and shifts in position across the striped geometry of the device. The variation is explained to be due to bipolar amplification of the charge carriers generated in the MOSFET when a pulse focus includes a channel …

010302 applied physicsMaterials science010308 nuclear & particles physicsbusiness.industrySchottky diodeLaser01 natural scienceslaw.inventionchemistry.chemical_compoundchemistrylawLogic gate0103 physical sciencesMOSFETSilicon carbideOptoelectronicsCharge carrierPower MOSFETbusinessDiode2018 18th European Conference on Radiation and Its Effects on Components and Systems (RADECS)
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SiC Power Switches Evaluation for Space Applications Requirements

2016

We have evaluated several SiC power switches available on the market, by defining and performing a global test campaign oriented to Space applications requirements, in order to define their main benefits but also the limits of current SiC technology. This allowed to identify a number of target applications where SiC could be used as a technology push for a new generation of space electronics units. Silicon devices qualified for space systems above 600V for the switches and 1200V for the rectifiers are not available due to performances limitations of Si. Among the typical static and dynamic characterization, we have performed temperature and power stress and HTRB tests. More remarkably, we h…

010302 applied physicsMaterials scienceTechnology pushbusiness.industryMechanical EngineeringElectrical engineeringJFET02 engineering and technology021001 nanoscience & nanotechnologyCondensed Matter Physics01 natural sciencesPower (physics)Stress (mechanics)Reliability (semiconductor)Mechanics of Materials0103 physical sciencesMOSFETElectronic engineeringGeneral Materials SciencePower MOSFET0210 nano-technologybusinessRadiation hardeningMaterials Science Forum
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Automated Calculation Method to Determine the Output Power Based on the Frequency for Induction Heating IGBT Parallel Inverter

2007

The fact that some inverter topologies used in induction heating applications allow the soft switching working operation lets the progressive replacement of the MOSFET with the IGBT in high power inverters. This is due to two main reasons, the former is the IGBT reliability and the latter is the ratio defined as the price of the component per output power. In this article an automated method to determine the output power based on the frequency of an inverter build with different IGBT is described. To carry out this method is necessary to define the power cycle and to develop the calculation process which determines the energy losses in the working conditions of the resonant parallel inverte…

EngineeringReliability (semiconductor)Induction heatingElectricity generationbusiness.industryElectrical engineeringElectronic engineeringInverterTopology (electrical circuits)Insulated-gate bipolar transistorPower MOSFETbusinessPower (physics)2007 IEEE Power Electronics Specialists Conference
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A demagnetization circuit for forward converters

2009

This paper presents a demagnetization circuit able to operate the forward converter with an higher efficiency and with a wider input range. In particular, by the means of few added components, the magnetizing energy and the leakage one are continuously recovered, and the transformer reset and the primary mosfet OFF voltage clamp to the input, both under steady state and transient operations, are provided. The reduced voltage stress allows the converter to operate with a duty extended to unity over the typical 70% limit of the Active Clamp topology, with smaller output inductance, better converter dynamics and wider input range. Furthermore, thanks to this technique, by employing a duty appr…

Forward converterEngineeringbusiness.industryElectrical engineeringforward converters demagnetization circuit reset techniques active clampConvertersNetwork topologySettore ING-INF/01 - Elettronicalaw.inventionInductanceCapacitorlawElectronic engineeringPower MOSFETbusinessTransformerVoltage
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Investigation of the Impact of Neutron Irradiation on SiC Power MOSFETs Lifetime by Reliability Tests

2021

High temperature reverse-bias (HTRB), High temperature gate-bias (HTGB) tests and electrical DC characterization were performed on planar-SiC power MOSFETs which survived to accelerated neutron irradiation tests carried out at ChipIr-ISIS (Didcot, UK) facility, with terrestrial neutrons. The neutron test campaigns on the SiC power MOSFETs (manufactered by ST) were conducted on the same wafer lot devices by STMicroelectronics and Airbus, with different neutron tester systems. HTGB and HTRB tests, which characterise gate-oxide integrity and junction robustness, show no difference between the non irradiated devices and those which survived to the neutron irradiation tests, with neutron fluence…

Materials scienceNuclear engineeringneutron beamTP1-1185power device reliabilityBiochemistrySettore FIS/03 - Fisica Della MateriaArticleAnalytical Chemistrychemistry.chemical_compoundReliability (semiconductor)silicon carbideNeutron fluxSilicon carbideNeutronPower semiconductor deviceIrradiationElectrical and Electronic EngineeringPower MOSFETInstrumentationsingle event burnoutChemical technologySettore FIS/01 - Fisica SperimentaleNeutron radiationSettore FIS/07 - Fisica Applicata(Beni Culturali Ambientali Biol.e Medicin)Atomic and Molecular Physics and Opticschemistryfailure in timeSensors
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Heavy-ion induced single event effects and latent damages in SiC power MOSFETs

2022

The advantages of silicon carbide (SiC) power MOSFETs make this technology attractive for space, avionics and high-energy accelerator applications. However, the current commercial technologies are still susceptible to Single Event Effects (SEEs) and latent damages induced by the radiation environment. Two types of latent damage were experimentally observed in commercial SiC power MOSFETs exposed to heavy-ions. One is observed at bias voltages just below the degradation onset and it involves the gate oxide. The other damage type is observed at bias voltages below the Single Event Burnout (SEB) limit, and it is attributed to alterations of the SiC crystal-lattice. Focused ion beam (FIB) and s…

Materials scienceScanning electron microscopeRadiationFocused ion beamelektroniikkakomponentitIonSEEschemistry.chemical_compoundstomatognathic systempuolijohteetGate oxideSilicon carbideSiC MOSFETsHeavy-ionDetectors and Experimental TechniquesElectrical and Electronic EngineeringPower MOSFETSafety Risk Reliability and Qualitybusiness.industryionisoiva säteilyCondensed Matter PhysicsLatent damageAtomic and Molecular Physics and OpticsSurfaces Coatings and FilmsElectronic Optical and Magnetic MaterialssäteilyfysiikkachemistrytransistoritOptoelectronicsSiC MOSFETs; Heavy-ion; Latent damage; SEEsbusinessVoltageMicroelectronics Reliability
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Accelerated Tests on Si and SiC Power Transistors with Thermal, Fast and Ultra-Fast Neutrons

2020

Neutron test campaigns on silicon (Si) and silicon carbide (SiC) power MOSFETs and IGBTs were conducted at the TRIGA (Training, Research, Isotopes, General Atomics) Mark II (Pavia, Italy) nuclear reactor and ChipIr-ISIS Neutron and Muon Source (Didcot, U.K.) facility. About 2000 power transistors made by STMicroelectronics were tested in all the experiments. Tests with thermal and fast neutrons (up to about 10 MeV) at the TRIGA Mark II reactor showed that single-event burnout (SEB) failures only occurred at voltages close to the rated drain-source voltage. Thermal neutrons did not induce SEB, nor degradation in the electrical parameters of the devices. SEB failures during testing at ChipIr …

Materials sciencesingle-event burnoutNuclear engineeringneutron beamlcsh:Chemical technologypower device reliability01 natural sciencesBiochemistrySettore FIS/03 - Fisica Della MateriaArticleAnalytical ChemistryTRIGAlaw.inventionchemistry.chemical_compoundsilicon carbideDeratinglaw0103 physical sciencesSilicon carbidelcsh:TP1-1185NeutronPower semiconductor deviceElectrical and Electronic EngineeringPower MOSFETInstrumentation010302 applied physics010308 nuclear & particles physicsNuclear reactorAtomic and Molecular Physics and OpticsNeutron temperatureneutron beamschemistryfailure in timeSensors
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Failure Estimates for SiC Power MOSFETs in Space Electronics

2018

Silicon carbide (SiC) power metal-oxide-semiconductor field effect transistors (MOSFETs) are space-ready in terms of typical reliability measures. However, single event burnout (SEB) due to heavy-ion irradiation often occurs at voltages 50% or lower than specified breakdown. Failure rates in space are estimated for burnout of 1200 V devices based on the experimental data for burnout and the expected heavy-ion linear energy transfer (LET) spectrum in space. peerReviewed

Materials sciencesingle-event burnoutlcsh:Motor vehicles. Aeronautics. AstronauticsAerospace EngineeringBurnoutpower MOSFETs01 natural scienceschemistry.chemical_compoundReliability (semiconductor)silicon carbide0103 physical sciencesSilicon carbidePower semiconductor devicePower MOSFETheavy ionsavaruustekniikka010302 applied physicspower devicesreliabilityta114ta213010308 nuclear & particles physicsfailure ratessingle event effectsEngineering physicsPower (physics)säteilyfysiikkachemistrytransistoritField-effect transistorlcsh:TL1-4050VoltageAerospace
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Active snubber network design and implementation on the primary side of an isolated Ćuk converter realizing soft-switching for efficiency …

2008

This paper describes the process of improving the efficiency of an existing isolated DC/DC converter based on CUK topology with secondary side synchronous rectification, by means of the introduction of an active snubber network on the primary side. The snubber circuit reduces to zero the switching losses during the off-time interval of secondary SR. In particular, the efficiency improvement is due to the elimination of the primary MOSFET Coss output capacitance losses, and mainly of the reverse recovery losses on the secondary SR MOSFET. However, the insertion of the active snubber creates itself additional losses in the circuit, and therefore to measure the really introduced benefit it is …

Network planning and designEngineeringControl theorybusiness.industryElectronic engineeringSnubberĆuk converterTopology (electrical circuits)Power MOSFETConvertersbusinessNetwork topologyCapacitance2008 IEEE Power Electronics Specialists Conference
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Ion-Induced Energy Pulse Mechanism for Single-Event Burnout in High-Voltage SiC Power MOSFETs and Junction Barrier Schottky Diodes

2020

Heavy-ion data suggest that a common mechanism is responsible for single-event burnout (SEB) in 1200-V power MOSFETs and junction barrier Schottky (JBS) diodes. Similarly, heavy-ion data suggest a common mechanism is also responsible for leakage current degradation in both devices. This mechanism, based on ion-induced, highly localized energy pulses, is demonstrated in simulations and shown to be capable of causing degradation and SEB for both the MOSFETs and JBS diodes.

Nuclear and High Energy PhysicsMaterials science010308 nuclear & particles physicsbusiness.industrySchottky diodeHigh voltage01 natural sciencesIonchemistry.chemical_compoundNuclear Energy and EngineeringchemistryElectric field0103 physical sciencesMOSFETSilicon carbideOptoelectronicsElectrical and Electronic EngineeringPower MOSFETbusinessDiodeIEEE Transactions on Nuclear Science
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